Mune chaiyo uye yakaoma semiconductor yekugadzira maitiro ewafer kurongedza, kupisa kunetseka kwakafanana ne "muparadzi" akavanzika murima, anogara achityisidzira kunaka kwekurongedza uye kuita kwemachipisi. Kubva pamusiyano wemafuta ekuwedzera coefficients pakati pemachipisi uye yekurongedza zvinhu kusvika kune yakanyanya kushanduka tembiricha panguva yekurongedza, nzira dzechizvarwa dzekupisa kunetseka kwakasiyana, asi zvese zvinonongedza kumhedzisiro yekudzikisa goho uye kukanganisa kuvimbika kwenguva refu kwemachipisi. Iyo granite base, ine yakasarudzika zvinhu zvinhu, chinyararire ichiva ane simba "mubatsiri" mukubata nedambudziko rekupisa kwekushushikana.
Iyo thermal stress dilemma mune wafer packaging
Wafer kurongedza kunosanganisira basa rekubatana rezvinhu zvakawanda. Chips anowanzo kuumbwa semiconductor zvinhu zvakaita sesilicon, nepo kurongedza zvinhu senge mapurasitiki ekurongedza zvinhu uye substrates zvinosiyana mumhando. Kana tembiricha ichichinja panguva yekurongedza, zvinhu zvakasiyana zvinosiyana zvakanyanya muchiyero chekuwedzera kwekupisa uye kuputika nekuda kwekusiyana kwakakura kweiyo coefficient yekuwedzera kwekupisa (CTE). Semuenzaniso, iyo coefficient yekuwedzera kwekupisa kwesilicon machipisi ingangoita 2.6 × 10⁻⁶/℃, nepo coefficient yekuwedzera kwekupisa kwezvakajairwa epoxy resin molding zvinhu zvakakwira se15-20 × 10⁻⁶/℃. Iri gaka rakakura rinokonzera shrinkage degree ye chip uye yekurongedza zvinhu kuve asynchronous panguva yekutonhodza nhanho mushure mekurongedza, ichigadzira yakasimba yekupisa kushushikana painterface pakati pezviviri izvi. Pasi pekuenderera kwekuita kwekushushikana kwekupisa, iyo wafer inogona kupeta nekuremara. Muzviitiko zvakakomba, zvinogona kutokonzera kukanganisa kunouraya senge chip cracks, solder joint fractures, uye interface delamination, zvichikonzera kukanganisa kushanda kwemagetsi kwechip uye kudzikisira kwakanyanya kwehupenyu hwayo hwesevhisi. Zvinoenderana nehuwandu hwemaindasitiri, huwandu husina kunaka hwekurongedza kwewaferi hunokonzerwa nekupisa kwekushushikana kwemamiriro ekunze hunogona kunge hwakakwira kusvika pa10% kusvika 15%, ichive chinhu chakakosha chinodzikamisa budiriro uye yemhando yepamusoro yeindasitiri yesemiconductor.
Hunhu hwakanakira mabhesi egranite
Low coefficient of thermal expansion: Granite inonyanya kuumbwa nemaminerari makristasi akadai sequartz uye feldspar, uye coefficient yayo yekuwedzera kwemafuta yakaderera zvakanyanya, kazhinji kubva pa0.6 kusvika 5 × 10⁻⁶/℃, iri padyo neiyo yesilicon chips. Hunhu uhwu hunogonesa kuti panguva yekushanda kwemidziyo yekuisa, kunyangwe kana kusangana nekudziya kwekuwedzera, musiyano wekuwedzera kwekuwedzera pakati peGrans. Semuyenzaniso, kana tembiricha yachinja ne10 ℃, saizi yekusiyana kwepuratifomu yakavakirwa pachigadziko chegranite inogona kudzikiswa neinopfuura 80% kana ichienzaniswa neyechinyakare simbi base, iyo inoderedza zvakanyanya kushushikana kwekupisa kunokonzerwa neasynchronous thermal kuwedzera uye kudonha, uye inopa yakatsiga tsigiro nharaunda yewafer.
Yakanakisa thermal kugadzikana: Granite ine yakatanhamara yekudziya kugadzikana. Chimiro chayo chemukati chakaoma, uye makristasi akanyatsobatanidzwa kuburikidza ne ionic uye covalent zvisungo, zvichibvumira kunonoka kupisa conduction mukati. Kana iyo yekurongedza midziyo ikapinda yakaoma tembiricha kutenderera, iyo granite base inogona kunyatso kudzvanya pesvedzero yekushanduka kwekushisa pairi uye kuchengetedza yakagadzikana tembiricha munda. Zviyedzo zvakakodzera zvinoratidza kuti pasi peyakajairwa tembiricha yekuchinja kwemidziyo yekurongedza (senge ± 5 ℃ paminiti), tembiricha yepasi inofananidzwa kutsauka kweiyo granite base inogona kudzorwa mukati me ± 0.1 ℃, kudzivirira chiitiko chekupisa kwekushushikana kwekushisa kunokonzerwa nekusiyana kwekushisa kwenzvimbo, kuve nechokwadi chekuti wafer iri munzvimbo ine yunifomu uye yakagadzika nzira yekumisa uye yakagadzika paki. stress generation.
Yakanyanya kuomarara uye kudedera kunyorova: Panguva yekushanda kwewafer yekurongedza midziyo, michina inofamba mukati (senge mota, michina yekufambisa, nezvimwewo) inoburitsa vibrations. Kana aya mavibrations akaendeswa kune wafer, anozowedzera kukuvadzwa kunokonzerwa nekupisa kwekushushikana kune wafer. Mabhesi eGranite ane kuomarara kwepamusoro uye kuomarara kwepamusoro kupfuura izvo zvezvinhu zvakawanda zvesimbi, izvo zvinokwanisa kurwisa kupindira kwekunze kwekudengenyeka. Zvichakadaro, chimiro chayo chemukati chakasarudzika chinochipa neakanakisa vibration damping performance uye inoita kuti ibvise simba rekuzunguza nekukurumidza. Tsvagiridzo yetsvakiridzo inoratidza kuti chigadziko chegranite chinogona kudzikisa iyo yepamusoro-frequency vibration (100-1000Hz) inogadzirwa nekushanda kwemidziyo yekurongedza ne60% kusvika 80%, ichidzikisa zvakanyanya kubatanidza mhedzisiro yekuzunguza uye kushushikana kwekushisa, uye nekuwedzera kuve nechokwadi chepamusoro uye kuvimbika kwepamusoro kwekurongedza.
Practical application effect
Mumutsetse wekugadzira wafer yekurongedza yeinozivikanwa semiconductor yekugadzira bhizinesi, mushure mekuunza midziyo yekurongedza ine mabhesi egranite, zvinoshamisa zvakabudirira zvakaitwa. Zvichienderana nekuongororwa kwedata rekuongorora rezvimedu gumi mushure mekurongedzerwa, vasati vatora chigadziko chegranite, chirema chewafer warping chakakonzerwa nekupisa kwekushushikana kwaive 12%. Zvisinei, mushure mekushandura kune chigadziko chegranite, chiyero chekuremara chakadonha zvakanyanya kusvika mukati me3%, uye chiyero chegoho chakavandudzwa zvakanyanya. Pamusoro pezvo, bvunzo dzekuvimbika dzenguva refu dzakaratidza kuti mushure me1,000 kutenderera kwekushisa kwepamusoro (125 ℃) uye yakaderera tembiricha (-55 ℃), huwandu hwekutadza kwakabatana kweiyo chip kunoenderana neiyo granite base package yakaderedzwa ne70% kana ichienzaniswa neyechinyakare base package, uye kugadzikana kwekuita kwechip kwave kuri nani.
Sezvo semiconductor tekinoroji inoenderera mberi ichienda kune yakanyanya kurongeka uye diki saizi, izvo zvinodikanwa zvekupisa kushushikana kwekudzora muwafer packaging zviri kuwedzera kuomarara. Mabhesi eGranite, ane mabhenefiti akazara mukudzika kwekuwedzera kwemafuta, kugadzikana kwemafuta uye kudzikisira kwekudedera, yave sarudzo yakakosha yekuvandudza kunaka kwewafer kurongedza uye kuderedza kukonzeresa kwekushushikana kwekupisa. Ivo vari kutamba basa rinowedzera rakakosha mukuona kusimudzira kwakasimba kweiyo semiconductor indasitiri.
Nguva yekutumira: May-15-2025