Mukugadzirwa kwemasemiconductor chaiwo uye akaomarara ekurongedza mawafer, kushushikana kwekupisa kwakafanana ne "muparadzi" akavanzwa murima, achigara achityisidzira kunaka kwekurongedza uye mashandiro emachips. Kubva pamusiyano wekuwedzera kwekupisa pakati pemachips nezvinhu zvekurongedza kusvika pakuchinja kukuru kwekupisa panguva yekurongedza, nzira dzekugadzira kushushikana kwekupisa dzakasiyana, asi zvese zvinoratidza mhedzisiro yekudzikisa mwero wegoho uye kukanganisa kuvimbika kwemachips kwenguva refu. Gwaro regranite, rine hunhu hwaro hwakasiyana hwezvinhu, riri kuva "mubatsiri" ane simba mukugadzirisa dambudziko rekushushikana kwekupisa.
Dambudziko rekushushikana kwekupisa mumapakeji ewafer
Kurongedza mawafer kunosanganisira kushanda pamwe chete kwezvinhu zvakasiyana-siyana. Machipisi anowanzo umbwa nezvinhu zvakaita sesilicon, nepo zvinhu zvekurongedza zvakaita sepurasitiki uye zvinhu zvinosiyana mumhando. Kana tembiricha ikachinja panguva yekurongedza, zvinhu zvakasiyana zvinosiyana zvakanyanya mukuwedzera kwekupisa uye kudzikira nekuda kwekusiyana kukuru mu coefficient of thermal expansion (CTE). Semuenzaniso, coefficient of thermal expansion yesilicon chips inenge 2.6×10⁻⁶/℃, nepo coefficient of thermal expansion yezvinhu zve common epoxy resin molding iri pa15-20 ×10⁻⁶/℃. Mukana mukuru uyu unokonzera kuti shrinkage degree yechip nezvinhu zvekurongedza zvive zvisina kuenzana panguva yekutonhora mushure mekurongedza, zvichikonzera thermal stress yakasimba pakati pezviviri. Pasi pesimba rinoenderera mberi re thermal stress, wafer inogona kukotama uye kukanganisika. Muzviitiko zvakakomba, inogona kutokonzera zvikanganiso zvinouraya zvakaita sekutsemuka kwemachip, kuputsika kwemajoini e solder, uye delamination ye interface, zvichikonzera kukuvara kwemagetsi echip uye kudzikira kukuru muhupenyu hwayo hwekushanda. Zvichienderana nehuwandu hweindasitiri, mwero wekusakwana kwepakeji yewafer inokonzerwa nematambudziko ekupisa unogona kusvika pa10% kusvika ku15%, zvichiva chinhu chikuru chinotadzisa kukura kwakanaka uye kwemhando yepamusoro kweindasitiri yesemiconductor.
Zvakanakira zvegranite bases
Kuwanda kwemafuta emuchadenga: Granite inonyanya kuumbwa nemakristaro emaminerari akadai sequartz nefeldspar, uye kuwanda kwayo kwemafuta emuchadenga kwakaderera zvikuru, kazhinji kunobva pa0.6 kusvika 5×10⁻⁶/℃, iyo iri pedyo nesilicon chips. Hunhu uhwu hunoita kuti panguva yekushanda kwemidziyo yekurongedza mawafer, kunyangwe panosangana nekushanduka kwekushisa, mutsauko wekuwedzera kwemafuta emuchadenga pakati pegranite base nechip nezvinhu zvekurongedza unodzikira zvakanyanya. Semuenzaniso, kana tembiricha ikachinja ne10℃, kusiyana kwehukuru hwepuratifomu yekurongedza yakavakirwa pagranite base kunogona kuderedzwa neanopfuura 80% zvichienzaniswa nesimbi yechinyakare, izvo zvinoderedza zvakanyanya kushushikana kwemafuta kunokonzerwa nekuwedzera kwemafuta emuchadenga uye kudzikira, uye zvinopa rutsigiro rwakasimba kune wafer.
Kugadzikana kwakanaka kwazvo kwekupisa: Granite ine kugadzikana kwakanyanya kwekupisa. Chimiro chayo chemukati chakakora, uye makristaro akabatana zvakanyanya kuburikidza ne ionic uye covalent bonds, zvichibvumira kupisa kunononoka mukati. Kana michina yekurongedza ichipinda mumatanho akaomarara ekupisa, granite base inogona kudzvinyirira zvinobudirira simba rekuchinja kwekushisa pairi uye kuchengetedza nzvimbo yekupisa yakagadzikana. Kuedza kwakakodzera kunoratidza kuti pasi pekuchinja kwekushisa kwakajairika kwemidziyo yekurongedza (yakadai se ± 5℃ paminiti), kutsauka kwekushisa kwepamusoro kwechigadziko chegranite kunogona kudzorwa mukati me ± 0.1℃, kudzivirira chiitiko chekumanikidzwa kwekupisa kunokonzerwa nekusiyana kwekushisa kwenzvimbo, kuve nechokwadi chekuti wafer iri munzvimbo yekupisa yakafanana uye yakagadzikana mukati menguva yese yekurongedza, uye kuderedza kunobva kugadzirwa kwekushomeka kwekupisa.
Kuomarara kwakanyanya uye kudzima vibration: Munguva yekushanda kwemidziyo yekurongedza mawafer, zvikamu zvinofamba mukati (senge mota, michina yekutumira, nezvimwewo) zvinoburitsa vibration. Kana vibration idzi dzikaendeswa kuwafer, dzichawedzera kukuvara kunokonzerwa nekumanikidzwa kwekupisa kune wafer. Magadziko egranite ane kuomarara kwakanyanya uye kuomarara kwakakwira kupfuura kwezvinhu zvakawanda zvesimbi, izvo zvinogona kudzivirira zvinobudirira kukanganiswa nekuomarara kwekunze. Panguva iyi, chimiro chayo chemukati chakasiyana chinoipa simba rakanaka rekudzima vibration uye chinoita kuti ikwanise kubvisa simba rekudzima vibration nekukurumidza. Data rekutsvagisa rinoratidza kuti granite base inogona kuderedza vibration yepamusoro (100-1000Hz) inokonzereswa nekushanda kwemidziyo yekurongedza ne60% kusvika 80%, zvichideredza zvakanyanya kubatana kwevibration uye kushushikana kwekupisa, uye zvichiwedzera kuve nechokwadi chekuti wafer packaging yakanyatsojeka uye yakavimbika.
Mhedzisiro inoshanda yekushandisa
Mukugadzirwa kwewafer packaging yekambani inozivikanwa yekugadzira semiconductor, mushure mekuunza michina yekurongedza ine granite bases, kubudirira kukuru kwakaitwa. Zvichibva pakuongorora data rekuongorora re10,000 wafers mushure mekurongedza, vasati vatora granite base, chiyero chekukanganisika kwewafer warping chakakonzerwa nekushushikana kwekupisa chaive 12%. Zvisinei, mushure mekuchinjira kugranite base, chiyero chekukanganisika chakaderera zvakanyanya kusvika mukati me3%, uye chiyero chekubereka chakawedzera zvakanyanya. Uyezve, bvunzo dzekuvimbika kwenguva refu dzakaratidza kuti mushure me1,000 cycles yekupisa kwakanyanya (125℃) uye tembiricha yakaderera (-55℃), huwandu hwekukundikana kwe solder joints ye chip zvichibva pa granite base package hwakaderedzwa ne70% zvichienzaniswa ne base package yechinyakare, uye kugadzikana kwekushanda kwe chip kwakagadziridzwa zvakanyanya.
Sezvo tekinoroji ye semiconductor ichiramba ichifambira mberi kusvika pakunyatsorongeka uye kukura kudiki, zvinodiwa zvekudzora kushushikana kwekupisa muma wafer packaging zviri kuramba zvichiwedzera kuoma. Mabhesi egranite, ane mabhenefiti akazara mukuwedzera kwekushisa kushoma, kugadzikana kwekupisa uye kuderedza kuzununguka, ave sarudzo huru yekuvandudza mhando yekurongedza ma wafer uye kuderedza kukanganiswa kwekupisa. Ari kutamba basa rakakosha mukuona kuti indasitiri ye semiconductor inokura zvakanaka.
Nguva yekutumira: Chivabvu-15-2025