1. Kururama kwedimensional
Kudzikama: kupfava kwepamusoro pechigadziko kunofanirwa kusvika kune yakakwira mwero, uye chikanganiso cheflatness hachifanire kudarika ± 0.5μm mune chero 100mm × 100mm nzvimbo; Kune iyo yese base ndege, iko kukanganisa kweflatness kunodzorwa mukati me ± 1μm. Izvi zvinovimbisa kuti zvikamu zvakakosha zvemichina ye semiconductor, senge musoro wekuvhenekesa wemidziyo yelithography uye tafura yekuongorora yemidziyo yekuona chip, inogona kugadzikwa uye kushandiswa pane yakakwira-chaiyo ndege, ive nechokwadi chekurongeka kweiyo nzira yekuona uye kutenderera kwekubatanidza kwemidziyo, uye kudzivirira kutsauka kwekutsauka kwezvikamu zvinokonzerwa neiyo chip chigadziko chekugadzira, iyo inokanganisa kugadzirwa kwechinhu chisina kuenzana. kururama.
Kutwasanuka: Kutwasanuka kwemupendero wega wega wechigadziko kwakakosha. Munzira yehurefu, kukanganisa kwekururama hakufaniri kudarika ± 1μm pa 1m; Iyo diagonal yakatwasuka kukanganisa inodzorwa mukati me ± 1.5μm. Kutora yakakwirira-chaiyo lithography muchina semuenzaniso, apo tafura inofamba ichitevedza gwara rechitima chechigadziko, kutwasuka kwemupendero wechigadziko kunokanganisa zvakananga kurongeka kwetafura. Kana iyo yakatwasuka isingasviki pachiyero, iyo lithography pateni ichave yakakanganiswa uye yakaremara, zvichikonzera kuderedzwa kweiyo chip kugadzira goho.
Parallelism: Kukanganisa kweparallelism kwepamusoro nepasi pepasi pegadziko kunofanirwa kudzorwa mukati me ± 1μm. Kufanana kwakanaka kunogona kuvimbisa kugadzikana kwepakati pesimba regiravhiti mushure mekuiswa kwemidziyo, uye simba rechikamu chimwe nechimwe rakafanana. Mumichina yekugadzira semiconductor wafer, kana nzvimbo dzepamusoro nedzepasi dzechigadziko dzisina kufanana, wafer inotsvedza panguva yekugadziriswa, ichikanganisa maitiro ekuita senge etching uye kupfeka, uye nekudaro kukanganisa chip performance kuenderana.
Chechipiri, unhu hwezvinhu
Kuoma: Kuoma kwegranite base zvinhu kunofanirwa kusvika paShore kuoma HS70 kana pamusoro. Kuoma kwepamusoro kunogona kunyatso pikisa kupfeka kunokonzerwa nekufamba nguva dzose uye kupesana kwezvikamu panguva yekushanda kwemidziyo, kuve nechokwadi chokuti chigadziko chinogona kuchengetedza hukuru hwepamusoro mushure mekushandisa kwenguva refu. Mune chip kurongedza midziyo, iro robhoti ruoko runowanzo tora uye kuisa chip pachigadziko, uye kuomarara kwepamusoro kwechigadziko kunogona kuve nechokwadi kuti pasi harisi nyore kuburitsa zvikwenya uye kuchengetedza iko kurongeka kwekufamba kweruoko.
Density: The material density inofanira kuva pakati pe2.6-3.1 g/cm³. Kuwanda kwakakodzera kunoita kuti chigadziko chive nekugadzikana kwehutano hwakanaka, hunogona kuvimbisa kusimba kwakakwana kutsigira michina, uye haizounzi matambudziko pakuiswa uye kutakura kwemidziyo nekuda kwekurema kwakanyanya. Mune yakakura semiconductor yekuongorora michina, yakagadzikana base density inobatsira kudzikisa vibration kutapurirana panguva yekushanda kwemidziyo uye kunatsiridza kunyatsoona.
Thermal kugadzikana: mutsara wekuwedzera coefficient iri pasi pe5 × 10⁻⁶/℃. Semiconductor midziyo inonyanya kunzwisiswa nekushanduka kwekushisa, uye kugadzikana kwekupisa kwechigadziko kwakanangana nekurongeka kwemidziyo. Munguva yelithography process, kushanduka kwekushisa kunogona kukonzera kuwedzera kana kuputika kwechigadziko, zvichikonzera kutsauka kwehukuru hwekuratidzira. Iyo granite base ine yakaderera mutsara yekuwedzera coefficient inogona kudzora saizi shanduko mune diki diki kana tembiricha yekushanda yemidziyo ichichinja (kazhinji 20-30 ° C) kuve nechokwadi chekuti lithography chaiyo.
Chechitatu, kunaka kwepamusoro
Hushasha: Hushasha hwepamusoro Ra kukosha pahwaro haupfuure 0.05μm. Iyo yekupedzisira-yakatsetseka yepamusoro inogona kuderedza kushambadza kweguruva uye kusvibiswa uye kuderedza kukanganiswa kwehutsanana hwe semiconductor chip yekugadzira nharaunda. Mune guruva-isina workshop yekugadzira chip, zvidimbu zvidiki zvinogona kutungamira kune kuremara senge pfupi dunhu rechip, uye yakatsetseka pamusoro pechigadziko inobatsira kuchengetedza nzvimbo yakachena yemusangano uye kuvandudza chip goho.
Microscopic defects: Kumusoro kwechigadziko hakubvumidzwe kuve nekutsemuka kunooneka, maburi ejecha, pores uye zvimwe zvirema. Pamwero wemicroscopic, nhamba yezvirema zvine dhayamita yakakura kupfuura 1μm pa square centimita haifaniri kudarika 3 neelectron microscopy. Izvi zvinokanganisa zvinokanganisa kusimba kwechimiro uye kupfava kwepasi kwechigadziko, uye zvino kukanganisa kugadzikana uye kurongeka kwemidziyo.
Chechina, kugadzikana uye kusagadzikana kwekutya
Kugadzikana kweDynamic: Munzvimbo yakateedzeredzwa yevibration inogadzirwa nekushanda kwesemiconductor midziyo (vibration frequency range 10-1000Hz, amplitude 0.01-0.1mm), iyo vibration displacement yemakiyi ekumisikidza mapoinzi pabhesi inofanira kudzorwa mukati ± 0.05μm. Kutora semiconductor bvunzo midziyo semuenzaniso, kana iyo mudziyo wega vibration uye yakatenderedza vibration ichiendeswa kune hwaro panguva yekushanda, iko kurongeka kwechiratidzo chekuyedza kunogona kukanganiswa. Kugadzikana kwakanaka kwesimba kunogona kuvimbisa mhinduro dzakavimbika dzebvunzo.
Seismic kuramba: Nheyo yacho inofanirwa kunge iine kuita kwakanakisa kweseismic, uye inogona kukurumidza kudzikisira simba rekuzunguza kana raiswa kune kamwe kamwe kuzunguzika kwekunze (senge seismic wave simulation vibration), uye ive nechokwadi chekuti nzvimbo ine hukama yezvikamu zvakakosha zvemidziyo inoshanduka mukati ± 0.1μm. Mumafekitari e semiconductor munzvimbo dzinoita kudengenyeka kwenyika, zvigadziko zvinodzivirira kudengenyeka zvinogona kudzivirira zvinodhura midziyo ye semiconductor, kuderedza njodzi yekukuvara kwemidziyo uye kukanganisa kwekugadzira nekuda kwekudengenyeka.
5. Kugadzikana kwemakemikari
Corrosion resistance: Iyo granite base inofanira kumira kuparara kweanowanzo makemikari anoshandiswa mu semiconductor yekugadzira nzira, yakadai se hydrofluoric acid, aqua regia, etc. Mushure mekunyura mu hydrofluoric acid solution ine chikamu chikuru che 40% kwemaawa makumi maviri nemana, chiyero chekurasikirwa kwepamusoro hachifaniri kudarika 0.01%; Soak mu aqua regia (volume ratio ye hydrochloric acid kusvika nitric acid 3:1) kwemaawa gumi nemaviri, uye hapana zviratidzo zviri pachena zvekuora pamusoro. Iyo semiconductor yekugadzira maitiro inosanganisira akasiyana emakemikari etching uye ekuchenesa maitiro, uye yakanaka corrosion kupikisa kwechigadziko kunogona kuve nechokwadi kuti kushandiswa kwenguva refu mumamiriro emakemikari hakuregi, uye kurongeka uye kuvimbika kwechimiro kunochengetedzwa.
Anti-pollution: Base material ine yakaderera kunyura kwezvinosvibisa zvakajairika munzvimbo yekugadzira semiconductor, senge organic magasi, masimbi ions, etc. Kana yaiswa munzvimbo ine 10 PPM yemagasi eorganic (semuenzaniso, benzene, toluene) uye 1ppm yesimbi ions (semuenzaniso, ayoni emhangura, iron ion, iron ion, 72 maawa ekuchinja, sortating yemaawa manomwe nzvimbo yepasi haina basa. Izvi zvinodzivirira zvinosvibisa kubva kutama kubva pachigadziko kuenda kunzvimbo yekugadzira chip uye kukanganisa chip kunaka.
Nguva yekutumira: Mar-28-2025