Mune mafungu eiyo LED indasitiri yekusimudzira kune tekinoroji yeLED, iko kurongeka kweiyo kufa bonding michina inosarudza zvakananga goho re chip kurongedza uye kuita kwechigadzirwa. ZHHIMG, nekubatanidzwa kwayo kwakadzama kwesainzi yezvigadzirwa uye kunyatsogadzira kugadzira, inopa rutsigiro rwakakosha kumidziyo yekubatanidza ye LED uye yave simba rakakosha kutyaira tekinoroji muindasitiri iyi.
Ultra-yakakwirira kuomarara uye kugadzikana: Kuve nechokwadi che micron-level kufa bonding kurongeka
Iyo die bonding process ye leds inoda iyo chaiyo bonding yemamicron-saizi machipisi (ine diki saizi inosvika 50μm×50μm) pane substrate. Chero deformation ye base inogona kukonzera kufa bonding kuchinja. Kuwanda kweZHHIMG zvinhu kunosvika 2.7-3.1g/cm³, uye simba rayo rekumanikidza rinopfuura 200MPa. Munguva yekushanda kwemidziyo, inogona kunyatso ramba kuzununguka uye kuvhunduka kunokonzerwa nepamusoro-frequency kufamba kweiyo kufa bonding musoro (kusvika ka2000 paminiti). Chiyero chaicho chebhizimusi re LED rinotungamira rinoratidza kuti dhizaini yekufa ichishandisa iyo ZHHIMG base inogona kudzora chip offset mukati me ± 15μm, iyo iri 40% yakakwira kupfuura iyo yechinyakare base midziyo uye inozadzisa zvizere zvinodikanwa zveJEDEC J-STD-020D mwero wekufa bonding kurongeka.
Yakanyanya kugadzikana yemafuta: Kugadzirisa dambudziko rekukwira kwekushisa kwemidziyo
Kushanda kwenguva refu kwemidziyo yekubatanidza kufa kunogona kukonzera kupisa kwenzvimbo kukwira (kusvika pamusoro pe50 ℃), uye kuwedzera kwekupisa kwezvinhu zvakajairwa kunogona kushandura hukama pakati pemusoro wefa bonding uye substrate. Iyo coefficient yekuwedzera kwekushisa kweZHHIMG yakaderera se (4-8) × 10⁻⁶/℃, iyo inongova hafu yesimbi yakakandwa. Munguva yekuenderera mberi kwe8-awa yakakwirira-yakanyanya kushanda, shanduko yedimensional yeZHHIMG base yaive isingasviki 0.1μm, kuve nechokwadi chekutonga chaiko kwekufa bonding kudzvanywa uye kureba kudzivirira kukuvara kwechip kana kushomeka kwakashata kunokonzerwa nekupisa kwekupisa. Dhata kubva kuTaiwanese LED yekurongedza fekitori inoratidza kuti mushure mekushandisa iyo ZHHIMG base, iyo kufa bonding defect rate yakadzikira kubva pa3.2% kusvika 1.1%, ichichengetedza anopfuura mamirioni gumi mumitengo pagore.
High damping maitiro: Bvisa vibration kupindira
Iyo 20-50Hz vibration inogadzirwa nekumhanya-mhanya kwemusoro wekufa, kana isina kuderedzwa nenguva, ichakanganisa kuiswa kweiyo chip. Iyo yemukati yekristaro chimiro cheZHHIMG inoiisa iyo yakanakisa damping performance, ine damping reshiyo ye0.05 kusvika 0.1, inova 5 kusvika 10 nguva yemidziyo yesimbi. Yakasimbiswa ne ANSYS simulation, inogona kudzikisira iyo vibration amplitude neinopfuura 90% mukati memasekonzi 0.3, ichinyatso kuve nechokwadi chekugadzikana kweiyo kufa bonding process, ichiita iyo chip bonding Angle kukanganisa kushoma pane 0.5 °, uye kusangana nezvinodiwa zvakasimba zvema LED machipi eiyo tilt degree.
Kemikari kugadzikana: Inochinjika kune yakaoma kugadzirwa nharaunda
Mu LED kurongedza mashopu, makemikari akadai seanoyerera uye ekuchenesa maajenti anowanzoshandiswa. Zvigadzirwa zvechigadziko zvepasi zvinowanzoita corrosion, izvo zvinogona kukanganisa kurongeka kwavo. ZHHIMG inoumbwa nezvicherwa zvakaita sequartz uye feldspar. Iyo ine yakagadzikana makemikari ehupfumi uye yakanakisa kuramba kune acid uye alkali corrosion. Iko hakuna kujeka kwemakemikari maitiro mukati me pH ye 1 kusvika ku 14. Kushandiswa kwenguva refu hakuzokonzeri kusvibiswa kwesimbi ion, kuve nechokwadi chehutsanana hwemafa bonding nharaunda uye kusangana nezvinodiwa zve ISO 14644-1 Kirasi 7 yekuchenesa migero, ichipa chivimbiso chepamusoro-kuvimbika LED packaging.
Precision kugadzirisa kugona: Wana yakakwirira-chaiyo musangano
Ichivimba ne-ultra-precision processing tekinoroji, ZHHIMG inogona kudzora kudzika kwenheyo mukati me ± 0.5μm/m uye kushata kwepamusoro Ra≤0.05μm, ichipa chaiyo yekumisikidza mareferenzi eiyo chaiyo zvikamu senge kufa bonding misoro uye kuona masisitimu. Kuburikidza nekubatanidzwa kusina musono nepamusoro-chaizvo mutsara madhairekitori (kudzokorora kurongeka kwakaringana ± 0.3μm) uye laser rangefinders (resolution 0.1μm), iyo yese yekumisikidza kurongeka kweiyo kufa bonding michina yakakwidziridzwa kusvika padanho rinotungamira muindasitiri, kufambisa budiriro yetekinoroji ye LED mabhizinesi emunda.
Munguva yazvino yekusimudzira kusimudzira muindasitiri yeLED, ZHHIMG, ichishandisa mabhenefiti ayo maviri mukuita kwezvinhu uye maitiro ekugadzira, inopa yakagadzika uye yakavimbika chaiyo mhinduro dzemichina yekufa bonding, kusimudzira kurongedza kwe LED kune yakanyanya kurongeka uye kushanda nesimba, uye yave yakakosha simba rekutyaira tekinoroji iteration muindasitiri.
Nguva yekutumira: May-21-2025