Mukufambira mberi kwekuvandudzwa kweindasitiri ye LED kuenda kune tekinoroji ye LED, kunyatsojeka kwemidziyo ye die bonding kunosarudza zvakananga goho rekurongedza chips uye mashandiro echigadzirwa. ZHHIMG, nekubatanidzwa kwayo kwakadzama kwesainzi yezvinhu uye kugadzira kwakanyatsojeka, inopa rutsigiro rwakakosha kumidziyo ye die bonding ye LED uye yave simba guru rinosimudzira hunyanzvi hwetekinoroji muindasitiri.
Kuomarara kwakanyanya uye kugadzikana: Kuve nechokwadi che micron-level die bonding accuracy
Maitiro ekubatanidza ma LED anoda kubatana kwakanyatsogadzirwa nema chips ane saizi ye micron (nehukuru hudiki hunosvika 50μm×50μm) pa substrate. Chero kuchinja kwebase kunogona kukonzera kuti die bonding ichinje. Kuwanda kwezvinhu zveZHHIMG kunosvika 2.7-3.1g/cm³, uye simba rayo rekumanikidza rinodarika 200MPa. Munguva yekushanda kwemidziyo, inogona kudzivirira vibration uye shock inokonzerwa nekufamba kwemusoro we die bonding (kusvika ka2000 paminiti). Kuyerwa chaiko kwebhizinesi re LED rinotungamira kunoratidza kuti michina ye die bonding inoshandisa ZHHIMG base inogona kudzora chip offset mukati me ±15μm, iyo iri 40% yakakwira kupfuura yemidziyo yetsika uye inosangana zvizere nezvinodiwa zveJEDEC J-STD-020D standard ye die bonding accuracy.
Kugadzikana kwakanyanya kwekupisa: Kugadzirisa dambudziko rekuwedzera kwekupisa kwemidziyo
Kushanda kwenguva refu kwemidziyo yekubatanidza masimbi kunogona kukonzera kukwira kwekushisa kwenzvimbo (kusvika pamusoro pe50℃), uye kuwedzera kwekupisa kwezvinhu zvakajairika kunogona kuchinja nzvimbo iri pakati pemusoro wekubatanidza masimbi ne substrate. Kuwanda kwekuwedzera kwekupisa kweZHHIMG kwakaderera se (4-8) × 10⁻⁶/℃, inova hafu chete yesimbi yakakandwa. Munguva yekushanda kwemaawa masere kwakasimba, shanduko yehukuru hwechigadziko cheZHHIMG yaive pasi pe 0.1μm, zvichiita kuti kudzvanywa kwekubatanidza masimbi nekukwirira kudzorwe zvakanaka kudzivirira kukuvara kwemachipu kana kusashanda zvakanaka kunokonzerwa nekushanduka kwekupisa. Data kubva kufekitori yekurongedza ma LED yeTaiwan inoratidza kuti mushure mekushandisa base yeZHHIMG, chiyero chekugadzirisa masimbi chakadonha kubva pa3.2% kusvika pa1.1%, zvichichengetedza mari inodarika mamiriyoni gumi eyuan pagore.
Hunhu hwepamusoro hwekudzikisa mvura: Bvisa kupindira kwe vibration
Kudengenyeka kwe20-50Hz kunokonzereswa nekufamba nekukurumidza kwemusoro we die die, kana kukasadzikiswa nenguva, kuchakanganisa kunyatsorongeka kwenzvimbo ye chip. Maumbirwo emukati me crystal eZHHIMG anoita kuti chip iite damping performance yakanaka, ine damping ratio ye 0.05 kusvika 0.1, inova ka5 kusvika ka10 pane zvinhu zvesimbi. Yakasimbiswa ne ANSYS simulation, inogona kuderedza vibration amplitude neinopfuura 90% mukati memasekondi 0.3, zvichiita kuti die bonding process igare zvakanaka, zvichiita kuti chip bonding Angle error ive pasi pe 0.5°, uye inosangana nezvinodiwa zve LED chips zve tilt degree.
Kugadzikana kwemakemikari: Kunogona kugadziriswa munzvimbo dzakaoma dzekugadzira
Mumaworkshop ekurongedza e LED, makemikari akadai se fluxes uye cleansing agents anowanzo shandiswa. Zvinhu zvepasi zvinowanzo gadzirwa ne ngura, izvo zvinogona kukanganisa kururama kwazvo. ZHHIMG inoumbwa nezvicherwa zvakaita se quartz ne feldspar. Ine makemikari akasimba uye inodzivirira zvikuru ngura ye acid ne alkali. Hapana makemikari ari pachena ari mukati me pH range kubva pa 1 kusvika 14. Kushandiswa kwenguva refu hakuzokonzere kusvibiswa kwe ion yesimbi, zvichivimbisa kuchena kwe die bonding environment uye zvichizadzisa zvinodiwa ne ISO 14644-1 Class 7 cleanroom standards, zvichipa vimbiso ye LED packaging yakasimba.
Kugona kugadzirisa nemazvo: Kuwana musangano wakanyatsorongeka
Ichishandisa tekinoroji yekugadzira zvinhu nemazvo, ZHHIMG inogona kudzora kutsetseka kwehwaro mukati me ±0.5μm/m uye roughness yekumusoro Ra≤0.05μm, ichipa mareferensi chaiwo ekuisa zvinhu nemazvo zvakaita semisoro yedie bonding uye masisitimu ekuona. Kuburikidza nekubatanidzwa kwakanyatsonaka nemitsara ine magwara (kudzokorora positioning accuracy ±0.3μm) uye laser rangefinders (resolution 0.1μm), kunyatsorongeka kwenzvimbo yemidziyo yedie bonding kwakakwidziridzwa kusvika padanho repamusoro muindasitiri, zvichiita kuti makambani eLED abudirire mumunda weLED abudirire.
Munguva ino yekusimudzira nekukurumidza muindasitiri ye LED, ZHHIMG, ichishandisa zvayakanakira zviviri mukushanda kwezvinhu uye maitiro ekugadzira, inopa mhinduro dzakasimba uye dzakavimbika dzekugadzirisa michina ye die bonding, ichikurudzira kurongedza kwe LED kuti ive yakanyatsojeka uye inoshanda, uye yave chinhu chikuru chinosimudzira tekinoroji muindasitiri iyi.
Nguva yekutumira: Chivabvu-21-2025